Partner description and role
The Institute of Communications and Computer Systems of the National Technical University of Athens (ICCS/NTUA) was founded in 1989, as the research arm of the School of Electrical and Computer Engineering of the NTUA (SECE-NTUA), with which it is associated, in the field of telecommunications systems and computer systems. The primary mandate of ICCS/NTUA has been to provide the facilities and organisational environment through which research could be performed and through which post-graduate students could receive research stipends and researchers could be employed. At present ICCS/NTUA employs more than 500 researchers including SECE faculty staff, senior research scientists, and PhD students.

Role in project
Project coordination, definition of the system requirements, the component specifications and the design of the Terabit transceivers inside the data center environments in collaboration with Mellanox and ΤΙΜ, lead the system simulation activities that will provide feedback on the design activities, define together with Mellanox and TIM the testing protocols and benchmarking procedures for all prototypes, contribute in the characterization of the evaluation board for TERIPHIC optical subassembly with high speed electronics and experimental testbeds along with MLNX and TIM, the evaluation of TERIPHIC transceivers in lab settings and in real DC network settings with the contribution of MLNX and TIM. In WP7, dissemination, clustering and communication activities
Hercules Avramopoulos

Panos Groumas

Christos Tsokos
FhG-HHI is one of the leading laboratories worldwide with emphasis on InP-based discrete and PIC devices as well as polymer-based PLCs and optoelectronic integrated circuits (OEIC). In its Photonics Components (PC) department, HHI has successfully developed a wide range of photonic devices, in many cases in close cooperation with domestic and foreign SMEs. HHI's extensive expertise in photonic components has resulted in Polyboardô, a powerful polymer based photonic platform with an extensive toolbox, covering the needs of modern photonic telecom and datacom systems.

Role in project
FhG-HHI will lead WP3, which covers the development of the photonic components, the integration engine of the optical Terabit transceiver, and the flexible high-frequency interconnects (polymer FlexLines). FhG- HHI will provide the arrayed InP-based high speed O-Band EMLs and the arrayed photodiodes, as well as its hybrid photonic technology PolyBoard to integrate the InP actives with a polymer-based multiplexer/demultiplexer based on an AWG. FhG-HHI will work together with Ficontec to develop an automated mass-manufacturing process for the optical terabit transceiver. For the connectivity between optoelectronic elements and ICs, FhG will fabricate flexible interconnects based on their FlexLine technology. FhG-HHI will also take part in WP2, contributing in the design and specifications of the optoelectronic components and the assembly and packaging process. Finally, within WP7, FhG-HHI will participate in the dissemination activities publishing in international journals and presenting in international conferences the achieved developments, as well as contribute in the evaluation of the manufacturability aspects and definition of methods for high-volume production.
David de Felipe

Norbert Keil

Ute Troppenz

Martin Moehrle
ficontec is an innovative high-tech company and a recognized market leader for automated photonic packaging and testing systems for high-end opto-electronic components and PICs (photonics integrated circuits). Considerable process capability and dedicated assembly technologies have been accumulated in serving the needs of a broad selection of industry segments ñ including telecom and datacom, high-power diode laser assembly, sensing from bio-med to automotive, micro-optics, and more. ficonTEC has consistently retained a unique modular approach to production equipment design. Today, with a globally installed base totaling more than 500 machines, each one is the automated and optimized embodiment of a customer-defined process.

Role in project
ficonTEC will be mainly responsible for the identification of bottlenecks on the recent assembly process on the way to mass manufacturing and to address the most critical ones within this project. A systematic analysis of the assembly process developed at FhG-HHI will be performed and the cycle times and the yield of each individual process step from the first fiber preparation up to the final packaging will be done. Based on this analysis with statistical relevant data the process steps will be divided into steps for which commercially and proven systems are available on the market and into process stepf for which no solution exists. For the last ones, special concepts will be developed which then will be transferred into 3D models. The most crucial steps will be installed as lab systems so that the assembly concept can be verified and the way towards mass manufacturability will be proven.
Simon Kibben

Moritz Seyfried
III-V Lab is an industrial Research Laboratory created in 2004 by Alcatel-Lucent (now Nokia) and Thales. III-V Lab conducts R&D activities in the field of micro/nano-electronics and photonics semiconductor components for different applications: telecoms, defence, security, safety, space, etc. Located in Palaiseau, near Paris, its facilities include 4000 m2 of clean rooms, with capabilities in advanced material synthesis (MOCVD, MBE), advanced device processing (RIE, ICP, CAIBE, IBE), measuring, modelling and designing equipment. Its staff is composed of around 100 permanent researchers, plus about 25 PhD students. III-V Lab has also the capacity to produce limited quantities of epitaxial wafers, components, modules or subsystems. Such capacity is particularly adapted to address in a flexible way the rapid evolution of markets, offering to its members or industrial partners early access to high-differentiation components for their system development.

Role in project
III-V Lab will lead WP4 (InP-DHBT linear driver array development, BiCMOS electronics selection), in close collaboration with MLNX. III-V Lab will design and fabricate high speed InP-DHBT quad linear driver arrays and will actively take part in the critical tasks of system design and definition of integration and packaging engine in order to secure the compatibility of the InP-DHBT quad linear driver arrays with other key building blocks.
Jean-Yves Dupuy

Romain Hersent

Mellanox Technologies (NASDAQ: MLNX, TASE: MLNX) is a leading supplier of end-to-end InfiniBand and Ethernet interconnect solutions and services for servers and storage. Mellanox interconnect solutions increase data center efficiency by providing the highest throughput and lowest latency, delivering data faster to applications and unlocking system performance capability. Mellanox offers a choice of fast interconnect products: adapters, switches, software, cables and silicon that accelerate application runtime and maximize business results for a wide range of markets including high performance computing, enterprise data centers, Web 2.0, cloud, storage and financial services. Mellanox currently has more than 2,900 employees.

Role in project
MLNX participates in the project as system and packaging partner, which will exploit the technology developments of TERIPHIC. In particular: i) collaborate on the specification of the system requirements, ii) collaborate and elaborate on the system design of the TERIPHIC modules, iii) participate in the design activities regarding the length of the EML, PD, driver and TIA arrays, iv) select from within the company’s ecosystem the BiCMOS electronic components to be integrated in the transceivers, v) design, fabricate and bring up the transceiver mainboards for all prototypes, vi) preform the packaging of the 400 Gb/s and the 800 Gb/s pluggable transceivers and the 800 Gb/s and the 1.6 Tb/s mid-board optical transceivers, vii) be responsible for the development of the evaluation board for TERPIHICH proof-of-concept (BiCMOS electronics integrated with 4-ch. TOSA/ROSA), viii) participate in a part of the evaluation activities at ICCS/NTUA lab, ix) be responsible for the system integration of the pluggable and the mid- board transceivers with its commercial switch and for the performance evaluation of modules 1-4 in its DC demonstrator testbed (CloudX), x) participation in the final evaluation of transceiver modules in the DC testbed of TIM, and xi) coordinate the activities for the use of the foreground knowledge of the project and the consolidation of the overall exploitation plan.
Paraskevas Bakopoulos

Boaz Atias

Elad Mentovich

TIM (the single brand of the Group from the beginning of 2016 which combines Telecom Italia's solidity and TIM's innovation) operates in all the sectors of the advanced communications chain, with highly developed business in fixed-mobile communications and the Internet; in the office & system solutions (Olivetti); in research and development (TIMLab). It is present mainly in Europe, the Mediterranean Basin (TI Sparkle) and South America. At March 31, 2016, TIM has 11,6M retail physical accesses in Italy and a broadband portfolio equal to 9M accesses (7,1M retail and 1,9M wholesale). In the Italian mobile market, TIM is one of the main player with 29,8M lines. Abroad, TIM Brasil is the second largest operator by number of mobile lines (67.3M).

Role in project
TIM will provide its contribution both as network operator and service provider and end user of innovation actions developed within the projects. TIM will contribute to network and system architectures, use cases and scenarios definition and devices’ specifications. TIM will host the demos and trials that will be carried out in its Data Center infrastructure in Torino including the FutureNet CORD (Central Office as a data Center) test bed and in-field fiber interconnections between distributed Data Center sites: lab and field trials will be carried out within WP6 activities. Finally, TIM will contribute to dissemination and exploitation actions of the project results (WP6 and WP7).
Annachiara Pagano

Anna Chiado' Piat