To achieve this, TERIPHIC will leverage photonic integration concepts and develop a seamless chain of component fabrication, assembly automation and module characterization processes as the basis for high-volume production lines.

ficonTEC will contribute by optimizing assembly processes and hardware on a ficonTEC CL1500 system already in use at the Fraunhofer HHI, thus supporting the development of the required automated assembly hardware appropriate for high-volume manufacturing for as yet to be detailed module-specific align-&-attach processes. In the final stages of the project, ficonTEC will put forward a concept for the entire high-volume production line. Ultimately, the new transceiver design introduced by TERIPHIC will allow significant cost savings, not only due to assembly automation at the TOSA/ROSA stage, but also at the packaging level, and resulting in a cost below 1€/Gbps for the transceiver modules.
More details can be found at Fraunhofer HHI and via the EC’s CORDIS website.